The electronics packaging and testing industry is interested in the development of new methods for making contacts to electronic chips that allow improvement or replacement of conventional wirebonding or solder flip-chip techniques. One approach involves the use of flexible contact structures that are integrated with the package or the testing apparatus and allow the device to be fully contacted by simply placing and pressing the interconnect array into contact. This technology critically depends on the electrical properties of low-force electrical contacts. This research aims to characterize the electromechanical properties of such contacts, using instrumented MEMS force sensors. The research is in collaboration with Formfactor, Inc., a semiconductor test and packaging solutions provider.
