Refereed Journal Publications
1. M. Agarwal, S.A. Chandorkar, R.N. Candler, B. Kim, M.A. Hopcroft,
R. Melamud, C.M. Jha, T.W. Kenny and B. Murmann "Optimal
drive condition for nonlinearity reduction in electrostatic MEMS
resonators", Submitted to Applied Physics Letters (2006)
2. R.N. Candler, M.A. Hopcroft, B. Kim, W.-T. Park, R. Melamud, M.
Agarwal, G. Yama, A. Partridge, M. Lutz, and T.W. Kenny,
"Long-Term and Accelerated Life Testing of a Novel
Single-Wafer Vacuum Encapsulation for MEMS Resonators", To Be
Published IEEE JMEMS 15, XXX (2006).
3. E.N. Wang, S. Devasenathipathy, H. Lin, C.H. Hidrovo, J.G.
Santiago, K.E. Goodson, and T.W. Kenny, "A Hybrid Method for
Bubble Geometry Reconstruction in Two-Phase Microchannels",
Experiments in Fluids 40, 847 (2006).
4.C.H.
Hidrovo, T.A. Kramer, E.N. Wang, S.Vigneron, J.E.
Steinbrenner, J.M. Koo, F.M. Wang, D.W. Fogg, R.D.
Flynn, E.S. Lee, C.H. Cheng, T.W. Kenny, J.K. Eaton, and K.E.
Goodson, "Two-Phase Microfluidics for Semiconductor Circuits and
Fuel Cells," Heat Transfer Engineering, 27, 53 (2006).
5. T.W. Kenny,
K.E. Goodson, J.G Santiago, E.N.Wang, J-M Koo, L. Jiang, E.
Pop, S. Sinha, L. Zhang, D. Fogg, S. Yao, R. Flynn, CH Chang,
C.H. Hidrovo, "Advanced Cooling Technologies for
Microprocessors", International Journal of High Speed Electronics
and Systems, 15, 301 (2006).
6. K.Y. Yasumura, T.D. Stowe, A.N. Tewary, T.W. Kenny, and D.
Rugar, "Quality Factor Enhancement of in-situ-Self-Annealing
Silicon Microcantilevers", Submitted to IEEE JMEMS (2005).
7. A. Duwel, R.N. Candler, T.W. Kenny, M. Varghese,
"Engineering MEMS Resonators with Low Thermoelastic Damping",
Accepted IEEE JMEMS 10/06.
8. R.N. Candler, A. Duwel, M. Varghese, S. Chandorkar, M.
Hopcroft, W.T. Park, B. Kim, G. Yama, A. Partridge, M. Lutz, and
T.W. Kenny, "Impact of Geometry on Thermoelastic Dissipation in
Micromechanical Resonant Beams", IEEE JMEMS 15, 927 (2006).
9. W.T. Park, A. Partridge, R.N. Candler, V.
Ayanoor-Vitikkate, G. Yama, M. Lutz, and T.W. Kenny,
"Encapsulated Sub-Millimeter Piezoresistive Accelerometers",
JMEMS 15, 507 (2006).
10.
E.N. Wang, S. Devasenathipathy, J.G. Santiago, K.E. Goodson, and
T.W. Kenny, "Nucleation and Growth of Vapor Bubbles in a Heated
Silicon Microchannel," ASME Journal of Heat Transfer,
Vol. 128, p. 497. (2004)
11. B.W. King,
T.W. Kenny, and K.E Goodson, "Comparison of Thermal and
Piezoresistive Sensing Approaches for Atomic Force Microscopy
Topography Measurements", Appl. Phys. Lett. 85, 2086 (2004).
12. E.N. Wang, L. Zhang, L. Jiang, J.M. Koo, J.G. Maveety,
E.A. Sanchez, K.E. Goodson, and T.W. Kenny, "Micromachined Jets
for Liquid Impingement Cooling of VLSI Chips", JMEMS 13, 833
(2004).
13. L. Zhang, E.N. Wang, K.E. Goodson, and T.W. Kenny,
"Phase Change Phenomena in Silicon Microchannels", International
Journal of Heat and Mass Transfer 48, 1572 (2005).
14. E.N. Renuart, A.M. Fitzgerald, T.W. Kenny, R. H. Dauskardt,
"Fatigue Crack Growth in Micromachined Silngle Crystal
Silicon", Journal of Materials Research 19, 2635 (2004).
15. J.P. Lynch, A. Sundararajan, K.H. Law, A.S. Kiremidjian, T. Kenny
and S. Carryer, "Embedment of structural monitoring algorithms in
a wireless sensing unit", Structural Engineering and Mechanics,
15, 285-97 (2003).
16. R.N. Candler, W.T. Park, H.M. Li, G. Yama, A. Partridge, M.
Lutz, and T.W. Kenny, "Single Wafer Encapsulation of MEMS
Devices", IEEE Transactions on Advanced packaging 26, 227
(2003).
17. J.P. Lynch, A. Partridge, K.H. Law, T.W. Kenny, A.S.
Kiremidjian,E. Carryer, "Design of Piezoresistive MEMS-based
Accelerometer for Integration with Wireless Sensing Unit for
Structural Monitoring", Journal of AeroSpace Engineering, 16,
108 (2003).
18. Y. Hishinuma, T. Geballe, B. Moyzhes, and T.W. Kenny,
"Measurements of Cooling by Room-Temperature Thermionic Emission
across a Nanometer Gap" Journal of Applied Physics 94,4690
(2003).
Conference Publications
1. C. M. Jha, G. Bahl, R. Melamud, S. A. Chandorkar, M. A. Hopcroft, B. Kim, M. Agarwal, J. Salvia, H. Mehta and T. W. Kenny, "CMOS-Compatible Dual-Resonator MEMS Temperature Sensor with Milli-Degree Accuracy", Transducers 2007 Lyon France.
2. Chandra M. Jha, Matthew A. Hopcroft, Manu Agarwal, Saurabh A. Chandorkar, Rob N. Candler, Vijay Subramanian, Renata Melamud, Suhrid Bhat, Bongsang Kim, Kwan K. Park and Thomas W. Kenny, "In-chip Device-layer Thermal Isolation of MEMS Resonator for Lower Power Budget," Proceedings of IMECE2006 2006 ASME International Mechanical Engineering Congress and Exposition November 5-10, 2006, Chicago, Illinois, USA
3. M. Agarwal, K.K. Park, R.N. Candler, B. Kim,
M.A. Hopcroft, S.A. Chandorkar, C.M. Jha, R. Melamud, T.W. Kenny,
and B. Murmann, "Nonlinear Characterization of Electrostatic MEMS
Resonators", 2006 Frequency Control Symposium
(2006)
4. M. Agarwal,
K.K. Park, B. Kim, M.A. Hopcroft, S.A. Chandorkar, R.N. Candler, C.M.
Jha, R. Melamud, T.W. Kenny and B. Murmann, "Amplitude Noise
Induced Phase Noise in Electrostatic MEMS Resonators",
Proceedings of the 2006 Hilton Head Workshop in Solid State Sensors,
Actuators, and Microsystems, p62 (2006).
5. R Melamud, B. Kim, M.A. Hopcroft, S. Chandorkar, M. Agarwal, C.
Jha, S. Bhat, K.K. Park, and T.W. Kenny, "Composite Flexural
Mode Resonators with Reduced Temperature Coefficient of
Frequency", Proceedings of the 2006 Hilton Head Workshop in Solid
State Sensors, Actuators, and Microsystems, p90 (2006).
6. B. Kim, C.M. Jha, T. White, R.N. Candler, M. Hopcroft, M.
Agarwal, K.K. Park, R. Melamud, and T.W. Kenny, "Temperature
Dependence of Quality Factor in MEMS Resonators", Proceedings
2006 International Conference on MEMS, Istanbul, Turkey (2006).
7. M. Agarwal, K.K. Park, M. Hopcroft, S. Chandorkar, R.N. Candler,
B. Kim, R. Melamud, G. Yama, B. Murmann, and T.W. Kenny,
"Effects of Mechanical Vibrations and Bias Voltage Noise on Phase
Noise of MEMS Resonator-based Oscillators", Proceedings 2006
International Conference on MEMS, Istanbul, Turkey (2006).
8. M.A. Hopcroft, M. Agarwal, K.K. Park, B. Kim, C.M. Jha, R.N.
Candler, G. Yama, B. Murmann, and T.W. Kenny, "Temperature
Compensation of a MEMS Resonator using Quality Factor as a
Thermometer", Proceedings 2006 International Conference on MEMS,
Istanbul, Turkey (2006).
9. M. Agarwal, K. Park, R. Candler, M. Hopcroft, C. Jha, R.
Melamud, B. Kim, B. Muhrman, and T. Kenny, "Nonlinearity
Cancellation in MEMS Resonators for Improved Power Handling",
2005 International Electron Devices Meeting (2005).
10. R. Melamud, M. Hopcroft, C. Jha, B. Kim, S. Chandorkar, R.
Candler, T.W. Kenny, "Effects of Stress on the Temperature
Coefficient of Frequency in Double-Clamped Resonators",
Proceedings Transducers '05, 392-395 (2005).
11. W.T. Park, K.N. O'Connor, J.R. Mallon, T. Maetani, R.N.
Candler, V. Ayanoor-Vitikkate, J. Roberson, S. Puria, and T.W.
Kenny, "Sub-Millimeter Encapsulated Accelerometers : A Fully
Implantable Sensor for Cochlear Implants", Proceedings
Transducers '05 109-112 (2005).
12. R.N. Candler, W.T. Park, M. Hopcroft,, B. Kim, and
T.W. Kenny, "Hydrogen Diffusion and Pressure Control of
Encapsulated MEMS Resonators", Proceedings, Transducers '05,
597-600 (2005).
13. R.N. Candler, M. Hopcroft, C.W. Low, S. Chandorkar, B. Kim,
M. Varghese, A. Duwel, and T.W. Kenny, "Impact of Slot Location
in Thermoelastic Dissipation in Micromechanical Resonators",
Proceedings, Transducers '05, 920-923 (2005).
14. B. Kim, R.N. Candler, M. Hopcroft, M. Agarwal, W.T. Park,
and T.W. Kenny, "Frequency Stability of Wafer-Scale Encapsulated
MEMS Resonators", Proceedings, Transducers '05, 1965-1968
(2005).
15. W.T. Park, R.N. Candler, V.A. Vittikkate, M. Lutz, A.
Partridge, G. Yama, T.W. Kenny, "Fully-Encapsulated Sub-MM
Accelerometer", Proceedings18th IEEE International Conference on
MEMS, 347, Miami, Fl (2005), 347-350 (2005).
16. B. Kim, R. N. Candler, M. Hopcroft, M. Agarwal, W.T Park, J.T. Li, and T. Kenny, "Investigation of MEMS Resonator Characteristics for Long-Term
Operation and Wide Temperature Variation Condition", ASME Winter
Annual Meeting, Anaheim CA, 2004.
17. M. Hopcroft, R. Melamud, R.N. Candler, W-T. Park, B. Kim, G. Yama, A. Partridge, M. Lutz, and T.W. Kenny, "Active Temperature Compensation for Micromachined Resonators", Proceedings 2004 Solid State Sensors and Actuators Workshop, 364-367 (2004).
18. E.N. Wang, S. Devasenathipathy, C.H. Hidrovo, D.W. Fogg, J.M. Koo, J.G. Santiago. K.E. Goodson and T.W. Kenny, "A Quantitative Understanding of Transient Bubble Growth in Microchannelsusing PIV", Proceedings 2004 Solid State Sensors and Actuators Workshop, 101-102 (2004).
19. R.N. Candler, M. Hopcroft, WT. Park, S.A. Chandorkar, G. Yama, K.E. Goodson, M. Varghese, A.E. Duwel, A. Partridge, M. Lutz and T.W. Kenny, "Reduction in Thermoelastic Dissipation in Micromechanical Resonators by Disruption of Heat Transport", Proceedings 2004 Solid State Sensors and Actuators Workshop, 45-48 (2004).
20. T.W. Kenny, Y. Liang, B.L. Pruitt, J.A. Harley, M. Bartsch, and R. Rudnitsky, "Fundamental Noise in MEMS Force Sensors", Proceedings 2004 SPIE Conference on Fluctuations and Noise in Sensors and Measurements, Maspalomas Gran Canaria, 143-151 (2004).
21. G. Upadhya, P. Zhou, K. Goodson, M. Munch, and T.W. Kenny,
"Closed-Loop Cooling Technologies for Microprocessors",
Proceedings 2003 International Electronic Devices Meeting, Washington,
775-778 (2003).
22. W.T. Park, R.N. Candler, J. Cho, H. Li, H. Li, M. Lutz, A.
Partridge, G. Yama, and T.W. Kenny, "Wafer-Scale Encapsulation of
MEMS Devices", Proceedings InterPACK '03, Kanapaali, HI
IPACK 2003-35032 (2003).
23. W.T. Park, R.N. Candler, S. Kronmueller, M. Lutz, A.
Partridge, G. Yama, and T.W. Kenny, "Wafer-Scale Film
Encapsulation of Micromachined Accelerometers", Proceedings
Transducers '03, Boston, 1903-1906 (2003).
24. B.W. Chui, Y. Hishinuma, R. Budakian, H.J. Mamin, T.W.
Kenny, and D. Rugar, "Mass-Loaded Cantilevers with Suppressed
Higher-Order Modes for Magnetic Resonance Force Microscopy",
Proceedings Transducers '03, Boston, 1120-1123 (2003).
25. M.S. Bartsch, W. Federle, R.J. Full, and T.W. Kenny,
"Small Insect Force Measurements using a Custom MEMS Force
Sensor", Proceedings Transducers '03, Boston, 1035-1038 (2003).
26. R.N. Candler, H. Li, M. Lutz, W.T. Park, A.
Partridge, G. Yama, and T.W. Kenny, "Investigation of Energy Loss
Mechanisms in Micromechanical Resonators", Proceedings
Transducers '03, Boston, 332-335 (2003).
27. D.J. Laser, A.M. Meyeers, S. Yao, K.F. Bell, K.E. Goodson,
J.G. Santiago, and T.W. Kenny, "Silicon ElectroOsmotic MicroPumps
for Integrated Circuit Thermal Management", Proceedings
Transducers '03, Boston, 151-154 (2003).
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