The rapid development of high-speed, high-power, high-density integrated circuits
requires compact devices for cooling. Microchannel heat sinks are receiving
increasing attention because of their potential for removing large rates of heat
per unit surface area. Our objective of this project is to design and
fabricate two-phase heat exchangers integrated with electrokinetic (EK) pumps which
are capable of removing 200W/cm2 (about the chip power dissipation level
of the year 2005-2006) within 1W pump power consumption and 50C chip temperature rise.
Prof. Tom Kenny,
Ken Goodson, and
Juan Santiago cowork on
this three-year project (Jun. 1999-Jun. 2002) here at Stanford, and we also
collaborate with Intel Corporation and Sandia National Lab.
Single-phase Heat Exchanger
Two-phase Heat Transfer in Microchannels
Phase Change Phenomena in Microchannels
Acknowledgments
DARPA HERETIC Program
Stanford Graduate Fellowships
Stanford Nanofabrication Facility