Shingo Yoneoka Ph.D. Candidate Department of Mechanical Engineering Stanford University Advisor: Prof. Thomas W. Kenny Microstructures and Sensors Lab

Research Projects

• ALD-enhanced bolometer
• Fatigue study of silicon using epi-seal encapsulated microelectromechanical resonators
• Active acceleration compensation of MEMS resonators
• SiC-seal encapsulation of microelectromechanical resonators

Publication

Journal Publications

1. S. Yoneoka, J. C. Salvia, G. Bahl, R. Melamud, S. A. Chandorkar, and T. W. Kenny, "Active Electrostatic Compensation of Micromechanical Resonators Under Random Vibrations," JMEMS Letter, Vol. 19, No. 5, pp. 1270-1272, 2010. DOI: 10.1109/JMEMS.2010.2067444
2. S. Yoneoka, C. S. Roper, R. N. Candler, S. A. Chandorkar, A. B. Graham, J Provine, R. Maboudian, R. T. Howe, and T. W. Kenny, "Characterization of encapsulated micromechanical resonators sealed and coated with polycrystalline SiC," Journal of Microelectromechanical Systems, Vol. 19, No. 2, pp. 357-366, 2010. DOI: 10.1109/JMEMS.2010.2040460
3. A. B. Graham, M. W. Messana, P. G. Hartwell, J Provine, S. Yoneoka, R. Melamud, B. Kim, R. T. Howe, and T. W. Kenny, "A method for wafer-scale encapsulation of large lateral deflection MEMS devices," Journal of Microelectromechanical Systems, Vol. 19, No. 1, pp. 28-37, 2010. DOI: 10.1109/JMEMS.2009.2035717
4. B. Kim, R. N. Candler, R. Melamud, M. A. Hopcroft, S. Yoneoka, H. K. Lee, M. Agarwal, S. A. Chandorkar, G. Yama, and T. W. Kenny, "Hermeticity and diffusion investigation in polysilicon film encapsulation for microelectromechanical systems," Journal of applied physics, vol. 105, 2009. DOI: 10.1063/1.3054366
5. Y. Tagaya, S. Yoneoka, M. Baba, K. Fukuzawa, and Y. Mitsuya, "Effects of applied voltage and fence configurations on DNA separtion based on electrophoresisUsing nanostructured fence matrix," Transactions of the Japan Society of Mechanical Engineers Series A, Vol. 73, No. 726, pp. 555-561, 2007 (in Japanese).

Conference Publications

1. S. Yoneoka, M. Liger, G. Yama, R. Schuster, F. Purkl, J Provine, F. B. Prinz, R. T. Howe, and T. W. Kenny, "ALD-metal uncooled bolometer," Proc. 24th IEEE MEMS 2011, Cancun, Mexico, 2011, Accepted.
2. H. K. Lee, J. C. Salvia, S. Yoneoka, G. Bahl, Y. Q. Qu, R. Melamud, S. Chandorkar, M.A. Hopcroft, B. Kim, and T. W. Kenny, "Stable oscillation of MEMS resonators beyond the critical bifuracation point," Proc. Hilton Head Workshop, Jun. 6-10, 2010, pp. 70-73.
3. M. W. Messana, A. B. Graham, S. Yoneoka, R. T. Howe, and T. W. Kenny, "Packaging of large lateral deflection MEMS using a combination of fusion bonding and epitaxial reactor sealing," Proc. Hilton Head Workshop, Jun. 6-10, 2010, pp. 336-339.
4. M. A. Philippine, C.-F. Chiang, J. Salvia, C. M. Jha, S. Yoneoka, and T. W. Kenny, "Material distribution design for a piezoelectric energy harvester displaying geometric nonlinearity," Proc. Hilton Head Workshop, Jun. 6-10, 2010, pp. 451-454.
5. S. Yoneoka, Y. Q. Qu, S. Wang, M. W. Messana, A. B. Graham, J. Salvia, B. Kim, R. Melamud, G. Bahl, and T. W. Kenny, "High-cyclic fatigue experiments of single crystal silicon in an oxgen-free environment," Proc. 23rd IEEE MEMS 2010, Hong Kong, 2010, pp. 224-227.
6. G. Bahl, J. Salvia, I. Bargatin, S. Yoneoka, R. Melamud, B. Kim, S. Chandorkar, M. A. Hopcroft, R. Bahl, R. T. Howe, and R. Maboudian, "Charge-drift elimination in resonant electrostatic MEMS," Proc. 23rd IEEE MEMS 2010, Hong Kong, 2010, pp. 108-111.
7. H. K. Lee, S. Yoneoka, G. Bahl, J. Salvia, Y. Q. Qu, R. Melamud, S. Chandorkar, B. Kim, M. A. Hopcroft, and T. W. Kenny, "A novel characterization method for temperature compensation of composite resonators," Proc. 23rd IEEE MEMS 2010, Hong Kong, 2010, pp. 743-746.
8. H. K. Lee, J. Salvia, G. Bahl, R. Melamud, S. Yoneoka, Y. Q. Qu, S. Chandorkar, M. A. Hopcroft, B. Kim, and T. W. Kenny, "Influence of the temperature dependent A-f effect on the design and performace of MEMS oscillators," Proc. 23rd IEEE MEMS 2010, Hong Kong, 2010, pp. 699-702.
9. C. S. Roper, R. Candler, S. Yoneoka, T. Kenny, R. T. Howe, and R. Maboudian, "Simultaneous wafer-scale vacuum encapsulation and microstructure cladding with LPCVD polycrystalline 3C-SiC," Transducers 2009, pp. 1031-1034, 2009.
10. S. Yoneoka, G. Bahl, J. Salvia, K. L. Chen, A. B. Graham, H. K. Lee, G. Yama, R. N. Candler, T. W. Kenny, "Acceleration compensation of MEMS resonators using electrostatic tuning", Proc. 22nd IEEE MEMS 2009, Sorrento, Italy, 2009, pp. 805-808.
11. A. B. Graham, M. Messana, P. Hartwll, J. Provine, S. Yoneoka, B. Kim, R. Melamud, T. W. Kenny, "Wafer scale encapsulation of large lateral deflection MEMS structures", Proc. 22nd IEEE MEMS 2009, Sorrento, Italy, 2009, pp. 745-748.
12. G. Bahl, R. Melamud, B. Kim, S. Chandorkar, J. Salvia, M. A. Hopcrofy, R. G. Hennessy, S. Yoneoka, C. M. Jha, G. Yama, D. Elata, R. N. Candler, R. T. Howe, T. W. Kenny, "Observations of fixed and mobile charge in composite MEMS resonators", Proc. Hilton Head Workshop, Jun. 1-5, 2008, pp. 48-51.
13. B. Kim, R. N. Candler, R. Melamud, S. Yoneoka, H. K. Lee, G. Yama, T. W. Kenny, "Identification and management of diffusion pathways in polysilicon encapsulation for MEMS devices", Proc. 21st IEEE MEMS 2008, Tucson, AZ, USA, Jan. 13-17, 2008, pp. 104-107.

Contact Information

Address: Bldg. 530, Room 224, 440 Escondido Mall, Stanford, CA 94305
Email: yoneoka AT stanford DOT edu

Last modified: Wed Jan 5 15:05:22 PST 2011