Education
2006~present Stanford University Stanford, California
PhD. in Mechanical Engineering
2004~2006 Stanford University Stanford, California
Master of Science in Mechanical Engineering
1999~2003 National Taiwan University Taipei, Taiwan
Bachelor of Science in Mechanical Engineering
Research Interests
MEMS design, MEMS packaging and interconnects, Micro-fabrication, Sensor and transducer design and applications
Technical Skills
Computer programs: C/C++, MATLAB , L-Edit, COMSOL Multi-physics, Agilent ADS, HFSS.
Language: Mandarin (native), English (fluent)
Research Projects
Publications:
1. Chen, K-L; Silvia, J; Potter, RC, Howe, RT; Kenny, TW; “Performance Evaluation and Equivalent Model of Silicon Interconnects for Fully-Encapsulated RF MEMS Devices”, IEEE, Transactions on Advanced Packaging, In Press, 2008
2. B. Kim, M. Hopcroft, C. M. Jha, R. Melamud, S. Chandorkar, M. Agarwal, K. L. Chen, W. T. Park, R. Candler, G. Yama, A. Partridge, M. Lutz, T. W. Kenny, “Using MEMS to Build the Device and the Package,” Transducers/Eurosensors 2007, 2007.
3. Ayanoor Vitikkate, V; Chen, K-L; Park, WT; Kenny TW; “Development of a process for wafer scale encapsulation of devices with very wide trenches”. ASME IMECE 2006, Chicago.
4. Ayanoor Vitikkate, V; Chen, K-L (Presenter); Park, WT; Yama, G.; Kenny TW; “ Wafer Scale Encapsulation of Wide Gaps using oxidation of Sacrificial Beams”, IEEE IEMT 2006, Putrajaya, Malaysia. (IEMT2006ver2.pdf)
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5.Woo-Tae Park, Kevin N O'Connor, Kuan-Lin Chen, Joseph R Mallon Jr., Toshiki Maetani, Parmita Dalal, Rob N Candler, Vipin Ayanoor-Vitikkate, Joseph B Roberson Jr., Sunil Puria, Thomas W Kenny, “ULTRAMINIATURE ENCAPSULATED ACCELEROMETERS AS A FULLY IMPLANTABLE SENSOR FOR IMPLANTABLE HEARING AIDS”, Journal of Biomedical Microdevices, 2007 v.9, no.6, p.939-949 (Fully_Cochlear_implant_BMMD.pdf)
